Precision BGA Rework Lab
The difference between a permanent fix and a temporary patch. We use industrial infrared technology to repair the connections you can't see.
Start a TicketThe Invisible Failure
Most modern electronics (PS5, Xbox Series X, Gaming Laptops) don't have chips with "legs" anymore. Instead, the main processors float on thousands of microscopic metal balls called a Ball Grid Array (BGA).
Over time, the extreme heat of gaming causes the motherboard to expand and shrink. Eventually, one of those tiny balls cracks.
Magnified view of BGA solder balls under a chip. One crack here kills the device.
What Our Machine Can Do
This isn't a heat gun from a hardware store. Our rework station is a computer-controlled thermal laboratory capable of:
Precise Thermal Profiling
We program specific "Temperature Curves" that match the melting point of your specific device. The machine slowly warms the board (soak), ramps to reflow (217°C+), and cools it down—automatically.
Targeted Infrared Heating
Instead of blasting the whole board with hot air (which melts plastic connectors and pops capacitors), our machine focuses intense IR heat only on the chip being repaired.
Chip Replacement
If a GPU or RAM module is truly dead, we can use the vacuum pickup tool to lift the old chip off and solder a brand new one in its place with factory-level precision.
Board Warping Prevention
A massive bottom heating plate keeps the entire motherboard at a safe temperature (150°C) during the repair. This prevents the board from bending or "potato chipping" under stress.
Reflow vs. Reball: Understanding the Fix
Do you have a device that others said couldn't be fixed?
Let's Diagnose It